A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures

A numerical and experimental study of delamination of polymer-metal interfaces in plastic packages at solder reflow temperatures

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

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Bibliographic Details
Main Authors: Tay, A.A.O., Ma, Y., Nakamura, T., Ong, S.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Delamination
Hygro-thermal stress
Interfacial fracture mechanics
Moisture
Popcorn
Reliability
Online Access:http://scholarbank.nus.edu.sg/handle/10635/51549
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/51549

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