A novel test strategy for fine pitch wafer-level packaged devices

10.1109/TADVP.2007.898617

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Bibliographic Details
Main Authors:	Jayabalan, J., Rotaru, M.D., Rao, V.S., Kripesh, V., Iyer, M.K., Tay, A.A.O., Ooi, B.-L., Leong, M.-S.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Subjects:	Coplanar probe ELastomer mesh substrate Multigigahertz test Wafer-level package test and characterization
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/54653
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Institution:	National University of Singapore

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Summary:	10.1109/TADVP.2007.898617

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