A novel test strategy for fine pitch wafer-level packaged devices

• Main Authors: Jayabalan, J., Rotaru, M.D., Rao, V.S., Kripesh, V., Iyer, M.K., Tay, A.A.O., Ooi, B.-L., Leong, M.-S.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Coplanar probe; ELastomer mesh substrate; Multigigahertz test; Wafer-level package test and characterization
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/54653
• Institution: National University of Singapore

10.1109/TADVP.2007.898617