Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects

Journal of Electronic Materials

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Main Authors: Chu, L.W., Chim, W.K., Pey, K.L., Yeo, J.Y.K., Chan, L.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
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Online Access:http://scholarbank.nus.edu.sg/handle/10635/55330
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spelling sg-nus-scholar.10635-553302024-11-14T10:20:39Z Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects Chu, L.W. Chim, W.K. Pey, K.L. Yeo, J.Y.K. Chan, L. ELECTRICAL & COMPUTER ENGINEERING Electromigration Interconnects Low-frequency noise Reliability Resistance Voids Journal of Electronic Materials 30 12 1513-1519 JECMA 2014-06-17T02:41:52Z 2014-06-17T02:41:52Z 2001-12 Article Chu, L.W.,Chim, W.K.,Pey, K.L.,Yeo, J.Y.K.,Chan, L. (2001-12). Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects. Journal of Electronic Materials 30 (12) : 1513-1519. ScholarBank@NUS Repository. 03615235 http://scholarbank.nus.edu.sg/handle/10635/55330 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Electromigration
Interconnects
Low-frequency noise
Reliability
Resistance
Voids
spellingShingle Electromigration
Interconnects
Low-frequency noise
Reliability
Resistance
Voids
Chu, L.W.
Chim, W.K.
Pey, K.L.
Yeo, J.Y.K.
Chan, L.
Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects
description Journal of Electronic Materials
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Chu, L.W.
Chim, W.K.
Pey, K.L.
Yeo, J.Y.K.
Chan, L.
format Article
author Chu, L.W.
Chim, W.K.
Pey, K.L.
Yeo, J.Y.K.
Chan, L.
author_sort Chu, L.W.
title Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects
title_short Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects
title_full Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects
title_fullStr Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects
title_full_unstemmed Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects
title_sort combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/55330
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