Combined low-frequency noise and resistance measurements for void extraction in deep-submicrometer interconnects

Journal of Electronic Materials

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Bibliographic Details
Main Authors: Chu, L.W., Chim, W.K., Pey, K.L., Yeo, J.Y.K., Chan, L.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/55330
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Institution: National University of Singapore