Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations

10.1016/j.microrel.2009.06.030

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Bibliographic Details
Main Authors:	Tiedemann, A.-K., Kurz, K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/56061
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-56061
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spelling	sg-nus-scholar.10635-560612024-11-13T12:53:31Z Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations Tiedemann, A.-K. Kurz, K. Fakhri, M. Heiderhoff, R. Phang, J.C.H. Balk, L.J. ELECTRICAL & COMPUTER ENGINEERING 10.1016/j.microrel.2009.06.030 Microelectronics Reliability 49 9-11 1165-1168 MCRLA 2014-06-17T02:50:15Z 2014-06-17T02:50:15Z 2009-09 Article Tiedemann, A.-K., Kurz, K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J. (2009-09). Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations. Microelectronics Reliability 49 (9-11) : 1165-1168. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2009.06.030 00262714 http://scholarbank.nus.edu.sg/handle/10635/56061 000270611700046 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1016/j.microrel.2009.06.030
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Tiedemann, A.-K. Kurz, K. Fakhri, M. Heiderhoff, R. Phang, J.C.H. Balk, L.J.
format	Article
author	Tiedemann, A.-K. Kurz, K. Fakhri, M. Heiderhoff, R. Phang, J.C.H. Balk, L.J.
spellingShingle	Tiedemann, A.-K. Kurz, K. Fakhri, M. Heiderhoff, R. Phang, J.C.H. Balk, L.J. Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations
author_sort	Tiedemann, A.-K.
title	Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations
title_short	Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations
title_full	Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations
title_fullStr	Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations
title_full_unstemmed	Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations
title_sort	finite element analyses assisted scanning joule expansion microscopy on interconnects for failure analysis and reliability investigations
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/56061
_version_	1821183189450752000

Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations

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