Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations
10.1016/j.microrel.2009.06.030
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Main Authors: | Tiedemann, A.-K., Kurz, K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/56061 |
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Institution: | National University of Singapore |
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