Finite element analyses assisted Scanning Joule Expansion Microscopy on interconnects for failure analysis and reliability investigations

10.1016/j.microrel.2009.06.030

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Bibliographic Details
Main Authors: Tiedemann, A.-K., Kurz, K., Fakhri, M., Heiderhoff, R., Phang, J.C.H., Balk, L.J.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/56061
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Institution: National University of Singapore

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