A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

10.1007/s00170-005-0364-7

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Bibliographic Details
Main Authors: Liu, K., Li, X.P., Rahman, M., Neo, K.S., Liu, X.D.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Diamond tool
Ductile cutting
Edge radius
Silicon wafer
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59285
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Institution: National University of Singapore
Description
Summary:10.1007/s00170-005-0364-7

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