A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

10.1007/s00170-005-0364-7

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Bibliographic Details
Main Authors:	Liu, K., Li, X.P., Rahman, M., Neo, K.S., Liu, X.D.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Diamond tool Ductile cutting Edge radius Silicon wafer
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/59285
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Institution:	National University of Singapore

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spelling	sg-nus-scholar.10635-592852023-10-30T08:09:59Z A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers Liu, K. Li, X.P. Rahman, M. Neo, K.S. Liu, X.D. MECHANICAL ENGINEERING Diamond tool Ductile cutting Edge radius Silicon wafer 10.1007/s00170-005-0364-7 International Journal of Advanced Manufacturing Technology 32 7-8 631-637 IJATE 2014-06-17T06:09:40Z 2014-06-17T06:09:40Z 2007-04 Article Liu, K., Li, X.P., Rahman, M., Neo, K.S., Liu, X.D. (2007-04). A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers. International Journal of Advanced Manufacturing Technology 32 (7-8) : 631-637. ScholarBank@NUS Repository. https://doi.org/10.1007/s00170-005-0364-7 02683768 http://scholarbank.nus.edu.sg/handle/10635/59285 000244954700001 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Diamond tool Ductile cutting Edge radius Silicon wafer
spellingShingle	Diamond tool Ductile cutting Edge radius Silicon wafer Liu, K. Li, X.P. Rahman, M. Neo, K.S. Liu, X.D. A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
description	10.1007/s00170-005-0364-7
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Liu, K. Li, X.P. Rahman, M. Neo, K.S. Liu, X.D.
format	Article
author	Liu, K. Li, X.P. Rahman, M. Neo, K.S. Liu, X.D.
author_sort	Liu, K.
title	A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
title_short	A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
title_full	A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
title_fullStr	A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
title_full_unstemmed	A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
title_sort	study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/59285
_version_	1781781598819057664

A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

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