A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
10.1007/s00170-005-0364-7
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Main Authors: | Liu, K., Li, X.P., Rahman, M., Neo, K.S., Liu, X.D. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/59285 |
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Institution: | National University of Singapore |
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