A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers

10.1007/s00170-005-0364-7

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Bibliographic Details
Main Authors:	Liu, K., Li, X.P., Rahman, M., Neo, K.S., Liu, X.D.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Diamond tool Ductile cutting Edge radius Silicon wafer
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/59285
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Institution:	National University of Singapore

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