Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies

Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies

10.1016/j.actamat.2007.10.051

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Bibliographic Details
Main Authors: Yeap, K.B., Zeng, K., Chi, D.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Dielectrics
Interfaces
Nanoindentation
Thin films
Toughness
Online Access:http://scholarbank.nus.edu.sg/handle/10635/59890
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Institution: National University of Singapore
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