Dynamic responses and solder joint reliability under board level drop test

Dynamic responses and solder joint reliability under board level drop test

10.1016/j.microrel.2006.05.012

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Bibliographic Details
Main Authors: Luan, J.-e., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60012
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Institution: National University of Singapore
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Summary:10.1016/j.microrel.2006.05.012

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