Dynamic responses and solder joint reliability under board level drop test

10.1016/j.microrel.2006.05.012

Saved in:

Bibliographic Details
Main Authors:	Luan, J.-e., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/60012
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-60012
record_format	dspace
spelling	sg-nus-scholar.10635-600122023-10-25T20:41:23Z Dynamic responses and solder joint reliability under board level drop test Luan, J.-e. Tee, T.Y. Pek, E. Lim, C.T. Zhong, Z. MECHANICAL ENGINEERING 10.1016/j.microrel.2006.05.012 Microelectronics Reliability 47 2-3 450-460 MCRLA 2014-06-17T06:18:11Z 2014-06-17T06:18:11Z 2007-02 Article Luan, J.-e., Tee, T.Y., Pek, E., Lim, C.T., Zhong, Z. (2007-02). Dynamic responses and solder joint reliability under board level drop test. Microelectronics Reliability 47 (2-3) : 450-460. ScholarBank@NUS Repository. https://doi.org/10.1016/j.microrel.2006.05.012 00262714 http://scholarbank.nus.edu.sg/handle/10635/60012 000244598900044 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1016/j.microrel.2006.05.012
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Luan, J.-e. Tee, T.Y. Pek, E. Lim, C.T. Zhong, Z.
format	Article
author	Luan, J.-e. Tee, T.Y. Pek, E. Lim, C.T. Zhong, Z.
spellingShingle	Luan, J.-e. Tee, T.Y. Pek, E. Lim, C.T. Zhong, Z. Dynamic responses and solder joint reliability under board level drop test
author_sort	Luan, J.-e.
title	Dynamic responses and solder joint reliability under board level drop test
title_short	Dynamic responses and solder joint reliability under board level drop test
title_full	Dynamic responses and solder joint reliability under board level drop test
title_fullStr	Dynamic responses and solder joint reliability under board level drop test
title_full_unstemmed	Dynamic responses and solder joint reliability under board level drop test
title_sort	dynamic responses and solder joint reliability under board level drop test
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/60012
_version_	1781781749034909696

Dynamic responses and solder joint reliability under board level drop test

Similar Items