Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon

Effect of crystallographic orientation on wear of diamond tools for nano-scale ductile cutting of silicon

10.1016/j.wear.2004.03.012

Saved in:

書目詳細資料
Main Authors:	Uddin, M.S., Seah, K.H.W., Li, X.P., Rahman, M., Liy, K.
其他作者:	MECHANICAL ENGINEERING
格式:	Article
出版:	2014
主題:	Crystallographic orientation Ductile cutting Silicon Single crystal diamond Tool wear
在線閱讀:	http://scholarbank.nus.edu.sg/handle/10635/60039
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!
機構:	National University of Singapore

相似書籍

Effect of crystallographic orientation on wear of diamond tools in nanoscale ductile cutting of silicon
由: MOHAMMAD SHARIF UDDIN
出版: (2010)

Performance of single crystal diamond tools in ductile mode cutting of silicon
由: Uddin, M.S., et al.
出版: (2014)

Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
由: Li, X.P., et al.
出版: (2014)

Effect of crystalline orientation of a diamond tool on the machined surface in ductile mode cutting of silicon
由: Li, X.P., et al.
出版: (2014)

A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
由: Liu, K., et al.
出版: (2014)

CBN tool wear in ductile cutting of tungsten carbide
由: Liu, K., et al.
出版: (2014)

Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon
由: Cai, M.B., et al.
出版: (2014)

Effect of crystallographic orientation on cutting forces and surface finish in ductile cutting of KDP crystals
由: Chen, H., et al.
出版: (2014)

Nanometer scale ductile mode cutting of soda-lime glass
由: Liu, K., et al.
出版: (2014)

Nanometer-scale, ductile-mode cutting of soda-lime glass
由: Liu, K., et al.
出版: (2014)

A study of the diamond tool wear suppression mechanism in vibration-assisted machining of steel
由: Zhang, X., et al.
出版: (2014)

Effect of cutting edge radius in ductile mode cutting of brittle materials
由: SHAMSUL AREFIN
出版: (2010)

Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with diamond tools in relation to tool groove wear
由: Cai, M.B., et al.
出版: (2014)

A study of the performance of cutting polycrystalline Al 6061 T6 with single crystalline diamond micro-tools
由: Ding, X., et al.
出版: (2014)

The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer
由: Arefin, S., et al.
出版: (2014)

Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of silicon
由: Arefin, S., et al.
出版: (2014)

Study of Nanoscale Ductile Mode Cutting of Silicon Using Molecular Dynamics Simulation
由: CAI MINBO
出版: (2010)

Cutting edge controlled wear of alumina inserts
由: MD NAZMUL HAQUE
出版: (2010)

Transitions in wear mechanisms of alumina cutting tools
由: Goh, G.K.L., et al.
出版: (2014)

Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation
由: Cai, M.B., et al.
出版: (2014)

The effect of the cutting edge radius on a machined surface in the nanoscale ductile mode cutting of silicon wafer
由: Arefin, S., et al.
出版: (2014)

Study of the mechanism of nanoscale ductile mode cutting of silicon using molecular dynamics simulation
由: Cai, M.B., et al.
出版: (2014)

Atomic dynamics model for nanoscale ductile mode cutting of silicon wafers
由: HE TAO
出版: (2010)

Microgrooving on electroless nickel plated materials using a single crystal diamond tool
由: Rahman, K.M.R., et al.
出版: (2014)

Cutting performance of diamond tools during ultra-precision turning of electroless-nickel plated die materials
由: Pramanik, A., et al.
出版: (2014)

Critical undeformed chip thickness and cutting pressure in relation to ductile mode cutting of KDP crystal
由: Chen, H., et al.
出版: (2014)

Characterisation and online monitoring of wear behaviour of on-machine fabricated PCD micro-tool while vertical micro-grinding of BK7 glass
由: Perveen, A., et al.
出版: (2014)

Experimental Modelling of Cutting Forces as a Function of Tool Wear in End Milling
由: Ong, P.K.L., et al.
出版: (2014)

Characteristics of ultrasonic vibration-assisted ductile mode cutting of tungsten carbide
由: Liu, K., et al.
出版: (2014)

High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer
由: Cai, M.B., et al.
出版: (2014)

Effect of grain size on wear behaviour of alumina cutting tools
由: Goh, G.K.L., et al.
出版: (2014)

A study on critical depth of cuts in micro grooving
由: Son, S.-M., et al.
出版: (2014)

Performance of single crystal diamond tools with different rake angles during micro-grooving on electroless nickel plated die materials
由: Biddut, A.Q., et al.
出版: (2014)

Ultraprecision turning of electroless nickel: effects of crystal orientation and origin of diamond tools
由: Pramanik, A., et al.
出版: (2014)

Ductile-regime machining for fast tool servo diamond turning of micro-structured surfaces on brittle materials
由: Yu, D.P., et al.
出版: (2014)

A pressured air jet approach to tool wear minimization in cutting of metal matrix composites
由: Li, X.P., et al.
出版: (2014)

Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance
由: Liu, K., et al.
出版: (2014)

Influence of the workpiece crystallographic orientation on ultra-precision turning of KDP crystals
由: Zheng, Z., et al.
出版: (2014)

A novel method for determination of the subsurface damage depth in diamond turning of brittle materials
由: Yu, D.P., et al.
出版: (2014)

A study on ultrasonic vibration cutting of low alloy steel
由: Nath, C., et al.
出版: (2014)