Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package

10.1109/TCAPT.2009.2020696

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Bibliographic Details
Main Authors:	Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Yeo, D., Chan, K.C., Tan, J.B., Hsia, L.C., Sohn, D.K.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	65 nm Cu/low-k Finite element analysis Flip chip package Large-die Solder joint reliability
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/61027
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-61027
record_format	dspace
spelling	sg-nus-scholar.10635-610272024-11-13T13:22:59Z Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Yeo, D. Chan, K.C. Tan, J.B. Hsia, L.C. Sohn, D.K. MECHANICAL ENGINEERING 65 nm Cu/low-k Finite element analysis Flip chip package Large-die Solder joint reliability 10.1109/TCAPT.2009.2020696 IEEE Transactions on Components and Packaging Technologies 32 4 838-848 ITCPF 2014-06-17T06:30:10Z 2014-06-17T06:30:10Z 2009-12 Article Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Yeo, D., Chan, K.C., Tan, J.B., Hsia, L.C., Sohn, D.K. (2009-12). Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package. IEEE Transactions on Components and Packaging Technologies 32 (4) : 838-848. ScholarBank@NUS Repository. https://doi.org/10.1109/TCAPT.2009.2020696 15213331 http://scholarbank.nus.edu.sg/handle/10635/61027 000272489400018 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	65 nm Cu/low-k Finite element analysis Flip chip package Large-die Solder joint reliability
spellingShingle	65 nm Cu/low-k Finite element analysis Flip chip package Large-die Solder joint reliability Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Yeo, D. Chan, K.C. Tan, J.B. Hsia, L.C. Sohn, D.K. Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package
description	10.1109/TCAPT.2009.2020696
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Yeo, D. Chan, K.C. Tan, J.B. Hsia, L.C. Sohn, D.K.
format	Article
author	Ong, J.M.G. Tay, A.A.O. Zhang, X. Kripesh, V. Lim, Y.K. Yeo, D. Chan, K.C. Tan, J.B. Hsia, L.C. Sohn, D.K.
author_sort	Ong, J.M.G.
title	Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package
title_short	Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package
title_full	Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package
title_fullStr	Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package
title_full_unstemmed	Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package
title_sort	optimization of the thermomechanical reliability of a 65 nm cu/low-k large-die flip chip package
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/61027
_version_	1821198905407176704

Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package

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