Optimization of the thermomechanical reliability of a 65 nm Cu/Low-k large-die flip chip package

• Main Authors: Ong, J.M.G., Tay, A.A.O., Zhang, X., Kripesh, V., Lim, Y.K., Yeo, D., Chan, K.C., Tan, J.B., Hsia, L.C., Sohn, D.K.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Subjects: 65 nm Cu/low-k; Finite element analysis; Flip chip package; Large-die; Solder joint reliability
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/61027
• Institution: National University of Singapore

10.1109/TCAPT.2009.2020696