Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer

10.1007/s00170-009-2347-6

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Bibliographic Details
Main Authors:	Li, X., Cai, M., Rahman, M., Liang, S.
Other Authors:	MECHANICAL ENGINEERING
Format:	Article
Published:	2014
Subjects:	Crack initiation Molecular dynamics Nanoscale cutting Silicon wafer Upper bound
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/61408
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-61408
record_format	dspace
spelling	sg-nus-scholar.10635-614082023-10-29T22:54:08Z Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer Li, X. Cai, M. Rahman, M. Liang, S. MECHANICAL ENGINEERING Crack initiation Molecular dynamics Nanoscale cutting Silicon wafer Upper bound 10.1007/s00170-009-2347-6 International Journal of Advanced Manufacturing Technology 48 9-12 993-999 IJATE 2014-06-17T06:34:47Z 2014-06-17T06:34:47Z 2010-06 Article Li, X., Cai, M., Rahman, M., Liang, S. (2010-06). Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer. International Journal of Advanced Manufacturing Technology 48 (9-12) : 993-999. ScholarBank@NUS Repository. https://doi.org/10.1007/s00170-009-2347-6 02683768 http://scholarbank.nus.edu.sg/handle/10635/61408 000277795100016 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
topic	Crack initiation Molecular dynamics Nanoscale cutting Silicon wafer Upper bound
spellingShingle	Crack initiation Molecular dynamics Nanoscale cutting Silicon wafer Upper bound Li, X. Cai, M. Rahman, M. Liang, S. Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
description	10.1007/s00170-009-2347-6
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Li, X. Cai, M. Rahman, M. Liang, S.
format	Article
author	Li, X. Cai, M. Rahman, M. Liang, S.
author_sort	Li, X.
title	Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
title_short	Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
title_full	Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
title_fullStr	Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
title_full_unstemmed	Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
title_sort	study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/61408
_version_	1781782044398845952

Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer

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