Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer

10.1007/s00170-009-2347-6

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Bibliographic Details
Main Authors: Li, X., Cai, M., Rahman, M., Liang, S.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61408
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Institution: National University of Singapore
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