Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer

Study of the upper bound of tool edge radius in nanoscale ductile mode cutting of silicon wafer

10.1007/s00170-009-2347-6

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Bibliographic Details
Main Authors: Li, X., Cai, M., Rahman, M., Liang, S.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Crack initiation
Molecular dynamics
Nanoscale cutting
Silicon wafer
Upper bound
Online Access:http://scholarbank.nus.edu.sg/handle/10635/61408
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Institution: National University of Singapore

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