Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
Microelectronics Reliability
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sg-nus-scholar.10635-621812024-11-13T12:54:05Z Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) Fiege, G.B.M. Feige, V. Phang, J.C.H. Maywald, M. Görlich, S. Balk, L.J. ELECTRICAL ENGINEERING Microelectronics Reliability 38 6-8 957-961 MCRLA 2014-06-17T06:48:16Z 2014-06-17T06:48:16Z 1998 Article Fiege, G.B.M.,Feige, V.,Phang, J.C.H.,Maywald, M.,Görlich, S.,Balk, L.J. (1998). Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM). Microelectronics Reliability 38 (6-8) : 957-961. ScholarBank@NUS Repository. 00262714 http://scholarbank.nus.edu.sg/handle/10635/62181 NOT_IN_WOS Scopus |
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Microelectronics Reliability |
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ELECTRICAL ENGINEERING Fiege, G.B.M. Feige, V. Phang, J.C.H. Maywald, M. Görlich, S. Balk, L.J. |
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Fiege, G.B.M. Feige, V. Phang, J.C.H. Maywald, M. Görlich, S. Balk, L.J. |
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Fiege, G.B.M. Feige, V. Phang, J.C.H. Maywald, M. Görlich, S. Balk, L.J. Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) |
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Fiege, G.B.M. |
title |
Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) |
title_short |
Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) |
title_full |
Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) |
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Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) |
title_full_unstemmed |
Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) |
title_sort |
failure analysis of integrated devices by scanning thermal microscopy (sthm) |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/62181 |
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