Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)

Microelectronics Reliability

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Main Authors: Fiege, G.B.M., Feige, V., Phang, J.C.H., Maywald, M., Görlich, S., Balk, L.J.
Other Authors: ELECTRICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/62181
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Institution: National University of Singapore
id sg-nus-scholar.10635-62181
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spelling sg-nus-scholar.10635-621812024-11-13T12:54:05Z Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) Fiege, G.B.M. Feige, V. Phang, J.C.H. Maywald, M. Görlich, S. Balk, L.J. ELECTRICAL ENGINEERING Microelectronics Reliability 38 6-8 957-961 MCRLA 2014-06-17T06:48:16Z 2014-06-17T06:48:16Z 1998 Article Fiege, G.B.M.,Feige, V.,Phang, J.C.H.,Maywald, M.,Görlich, S.,Balk, L.J. (1998). Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM). Microelectronics Reliability 38 (6-8) : 957-961. ScholarBank@NUS Repository. 00262714 http://scholarbank.nus.edu.sg/handle/10635/62181 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description Microelectronics Reliability
author2 ELECTRICAL ENGINEERING
author_facet ELECTRICAL ENGINEERING
Fiege, G.B.M.
Feige, V.
Phang, J.C.H.
Maywald, M.
Görlich, S.
Balk, L.J.
format Article
author Fiege, G.B.M.
Feige, V.
Phang, J.C.H.
Maywald, M.
Görlich, S.
Balk, L.J.
spellingShingle Fiege, G.B.M.
Feige, V.
Phang, J.C.H.
Maywald, M.
Görlich, S.
Balk, L.J.
Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
author_sort Fiege, G.B.M.
title Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_short Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_full Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_fullStr Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_full_unstemmed Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_sort failure analysis of integrated devices by scanning thermal microscopy (sthm)
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/62181
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