Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)

Microelectronics Reliability

Saved in:
書目詳細資料
Main Authors: Fiege, G.B.M., Feige, V., Phang, J.C.H., Maywald, M., Görlich, S., Balk, L.J.
其他作者: ELECTRICAL ENGINEERING
格式: Article
出版: 2014
在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/62181
標簽: 添加標簽
沒有標簽, 成為第一個標記此記錄!
機構: National University of Singapore
id sg-nus-scholar.10635-62181
record_format dspace
spelling sg-nus-scholar.10635-621812024-11-13T12:54:05Z Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM) Fiege, G.B.M. Feige, V. Phang, J.C.H. Maywald, M. Görlich, S. Balk, L.J. ELECTRICAL ENGINEERING Microelectronics Reliability 38 6-8 957-961 MCRLA 2014-06-17T06:48:16Z 2014-06-17T06:48:16Z 1998 Article Fiege, G.B.M.,Feige, V.,Phang, J.C.H.,Maywald, M.,Görlich, S.,Balk, L.J. (1998). Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM). Microelectronics Reliability 38 (6-8) : 957-961. ScholarBank@NUS Repository. 00262714 http://scholarbank.nus.edu.sg/handle/10635/62181 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description Microelectronics Reliability
author2 ELECTRICAL ENGINEERING
author_facet ELECTRICAL ENGINEERING
Fiege, G.B.M.
Feige, V.
Phang, J.C.H.
Maywald, M.
Görlich, S.
Balk, L.J.
format Article
author Fiege, G.B.M.
Feige, V.
Phang, J.C.H.
Maywald, M.
Görlich, S.
Balk, L.J.
spellingShingle Fiege, G.B.M.
Feige, V.
Phang, J.C.H.
Maywald, M.
Görlich, S.
Balk, L.J.
Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
author_sort Fiege, G.B.M.
title Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_short Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_full Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_fullStr Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_full_unstemmed Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
title_sort failure analysis of integrated devices by scanning thermal microscopy (sthm)
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/62181
_version_ 1821215779217997824