Failure analysis of integrated devices by Scanning Thermal Microscopy (SThM)
Microelectronics Reliability
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Main Authors: | Fiege, G.B.M., Feige, V., Phang, J.C.H., Maywald, M., Görlich, S., Balk, L.J. |
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其他作者: | ELECTRICAL ENGINEERING |
格式: | Article |
出版: |
2014
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在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/62181 |
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