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In situ trench etching and releasing technique of high aspect ratio beams using magnetically enhanced reactive ion etching

10.1116/1.1431961

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書目詳細資料
Main Authors: Kok, K.W., Yoo, W.J., Sooriakumar, K.
其他作者: ELECTRICAL & COMPUTER ENGINEERING
格式: Conference or Workshop Item
出版: 2014
在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/70574
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