In situ trench etching and releasing technique of high aspect ratio beams using magnetically enhanced reactive ion etching

In situ trench etching and releasing technique of high aspect ratio beams using magnetically enhanced reactive ion etching

10.1116/1.1431961

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Bibliographic Details
Main Authors: Kok, K.W., Yoo, W.J., Sooriakumar, K.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/70574
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Institution: National University of Singapore
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