Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73243 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| id |
sg-nus-scholar.10635-73243 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-732432015-02-16T11:48:43Z Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004 601-907 2014-06-19T05:32:49Z 2014-06-19T05:32:49Z 2004 Conference Paper Tay, A.A.O. (2004). Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages. Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004 : 601-907. ScholarBank@NUS Repository. 0780384202 http://scholarbank.nus.edu.sg/handle/10635/73243 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. |
| spellingShingle |
Tay, A.A.O. Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages |
| author_sort |
Tay, A.A.O. |
| title |
Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages |
| title_short |
Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages |
| title_full |
Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages |
| title_fullStr |
Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages |
| title_full_unstemmed |
Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages |
| title_sort |
challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73243 |
| _version_ |
1681087712524763136 |