Challenges of thermomechanical design and modeling of ultra fine-pitch wafer level packages
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
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| Format: | Conference or Workshop Item |
| Published: |
2014
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| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73243 |
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| Institution: | National University of Singapore |