Crystallographic orientation of Ta/TaN bilayer and its effect on seed and bulk Cu 〈111〉 formation

Crystallographic orientation of Ta/TaN bilayer and its effect on seed and bulk Cu 〈111〉 formation

Advanced Metallization Conference (AMC)

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Bibliographic Details
Main Authors: Ho, C.S., Liew, S.L., See, A., Lim, C.Y.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73294
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Institution: National University of Singapore
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Summary:Advanced Metallization Conference (AMC)

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