Crystallographic orientation of Ta/TaN bilayer and its effect on seed and bulk Cu 〈111〉 formation
Advanced Metallization Conference (AMC)
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Main Authors: | Ho, C.S., Liew, S.L., See, A., Lim, C.Y.H. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73294 |
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Institution: | National University of Singapore |
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