Fabrication and parametric study of wafer-level multiple-copper-column interconnect

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors:	Liao, E.B., Ang, S.S., Tay, A.A.O., Feng, H.H., Nagarajan, R., Kripesh, V.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73456
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73456
record_format	dspace
spelling	sg-nus-scholar.10635-734562024-11-13T13:23:17Z Fabrication and parametric study of wafer-level multiple-copper-column interconnect Liao, E.B. Ang, S.S. Tay, A.A.O. Feng, H.H. Nagarajan, R. Kripesh, V. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 2 1251-1255 PECCA 2014-06-19T05:35:20Z 2014-06-19T05:35:20Z 2004 Conference Paper Liao, E.B.,Ang, S.S.,Tay, A.A.O.,Feng, H.H.,Nagarajan, R.,Kripesh, V. (2004). Fabrication and parametric study of wafer-level multiple-copper-column interconnect. Proceedings - Electronic Components and Technology Conference 2 : 1251-1255. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73456 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Proceedings - Electronic Components and Technology Conference
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Liao, E.B. Ang, S.S. Tay, A.A.O. Feng, H.H. Nagarajan, R. Kripesh, V.
format	Conference or Workshop Item
author	Liao, E.B. Ang, S.S. Tay, A.A.O. Feng, H.H. Nagarajan, R. Kripesh, V.
spellingShingle	Liao, E.B. Ang, S.S. Tay, A.A.O. Feng, H.H. Nagarajan, R. Kripesh, V. Fabrication and parametric study of wafer-level multiple-copper-column interconnect
author_sort	Liao, E.B.
title	Fabrication and parametric study of wafer-level multiple-copper-column interconnect
title_short	Fabrication and parametric study of wafer-level multiple-copper-column interconnect
title_full	Fabrication and parametric study of wafer-level multiple-copper-column interconnect
title_fullStr	Fabrication and parametric study of wafer-level multiple-copper-column interconnect
title_full_unstemmed	Fabrication and parametric study of wafer-level multiple-copper-column interconnect
title_sort	fabrication and parametric study of wafer-level multiple-copper-column interconnect
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73456
_version_	1821208621739933696

Fabrication and parametric study of wafer-level multiple-copper-column interconnect

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