Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications

Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications

10.1109/EPTC.2006.342692

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Bibliographic Details
Main Authors: Sekhar, V.N., Balakumar, S., Chai, T.C., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73558
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Institution: National University of Singapore
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Summary:10.1109/EPTC.2006.342692

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