Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications

10.1109/EPTC.2006.342692

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Main Authors:	Sekhar, V.N., Balakumar, S., Chai, T.C., Tay, A.A.O.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73558
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73558
record_format	dspace
spelling	sg-nus-scholar.10635-735582015-01-12T07:36:29Z Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications Sekhar, V.N. Balakumar, S. Chai, T.C. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/EPTC.2006.342692 Proceedings of the Electronic Packaging Technology Conference, EPTC 63-69 2014-06-19T05:36:33Z 2014-06-19T05:36:33Z 2006 Conference Paper Sekhar, V.N.,Balakumar, S.,Chai, T.C.,Tay, A.A.O. (2006). Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications. Proceedings of the Electronic Packaging Technology Conference, EPTC : 63-69. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2006.342692" target="_blank">https://doi.org/10.1109/EPTC.2006.342692</a> 142440665X http://scholarbank.nus.edu.sg/handle/10635/73558 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	10.1109/EPTC.2006.342692
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Sekhar, V.N. Balakumar, S. Chai, T.C. Tay, A.A.O.
format	Conference or Workshop Item
author	Sekhar, V.N. Balakumar, S. Chai, T.C. Tay, A.A.O.
spellingShingle	Sekhar, V.N. Balakumar, S. Chai, T.C. Tay, A.A.O. Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications
author_sort	Sekhar, V.N.
title	Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications
title_short	Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications
title_full	Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications
title_fullStr	Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications
title_full_unstemmed	Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications
title_sort	investigation of mechanical properties of black diamond™ (low-k) thin films for cu/low-k interconnect applications
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73558
_version_	1681087770202734592

Investigation of mechanical properties of black diamond™ (low-K) thin films for Cu/low-k interconnect applications

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