Mechanical behavior of Cu/low-k stacks with different barrier layers

Mechanical behavior of Cu/low-k stacks with different barrier layers

2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005

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Bibliographic Details
Main Authors: Sekhar, V.N., Balakumar, S., Tay, A.A.O., Sinha, S.K.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Adhesion strength
Cu/low-k
Nanoindentation
Nanoscratch
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73592
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Institution: National University of Singapore
Description
Summary:2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005

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