Mechanical behavior of Cu/low-k stacks with different barrier layers
2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005
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| Main Authors: | , , , |
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| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73592 |
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| Institution: | National University of Singapore |
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