Mechanical behavior of Cu/low-k stacks with different barrier layers
2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005
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2014
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sg-nus-scholar.10635-735922015-02-21T04:32:01Z Mechanical behavior of Cu/low-k stacks with different barrier layers Sekhar, V.N. Balakumar, S. Tay, A.A.O. Sinha, S.K. MECHANICAL ENGINEERING Adhesion strength Cu/low-k Nanoindentation Nanoscratch 2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005 257-265 2014-06-19T05:37:00Z 2014-06-19T05:37:00Z 2005 Conference Paper Sekhar, V.N.,Balakumar, S.,Tay, A.A.O.,Sinha, S.K. (2005). Mechanical behavior of Cu/low-k stacks with different barrier layers. 2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005 : 257-265. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/73592 NOT_IN_WOS Scopus |
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Adhesion strength Cu/low-k Nanoindentation Nanoscratch |
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Adhesion strength Cu/low-k Nanoindentation Nanoscratch Sekhar, V.N. Balakumar, S. Tay, A.A.O. Sinha, S.K. Mechanical behavior of Cu/low-k stacks with different barrier layers |
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2005 Proceedings - 22nd International VLSI Multilevel Interconnection Conference, VMIC 2005 |
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MECHANICAL ENGINEERING |
author_facet |
MECHANICAL ENGINEERING Sekhar, V.N. Balakumar, S. Tay, A.A.O. Sinha, S.K. |
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Conference or Workshop Item |
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Sekhar, V.N. Balakumar, S. Tay, A.A.O. Sinha, S.K. |
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Sekhar, V.N. |
title |
Mechanical behavior of Cu/low-k stacks with different barrier layers |
title_short |
Mechanical behavior of Cu/low-k stacks with different barrier layers |
title_full |
Mechanical behavior of Cu/low-k stacks with different barrier layers |
title_fullStr |
Mechanical behavior of Cu/low-k stacks with different barrier layers |
title_full_unstemmed |
Mechanical behavior of Cu/low-k stacks with different barrier layers |
title_sort |
mechanical behavior of cu/low-k stacks with different barrier layers |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73592 |
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1681087776192200704 |