Nano-precision measurement of diamond tool edge radius for wafer fabrication
10.1016/S0924-0136(03)00757-X
Saved in:
Main Authors: | Li, X.P., Rahman, M., Liu, K., Neo, K.S., Chan, C.C. |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73672 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers
by: Liu, K., et al.
Published: (2014) -
The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer
by: Arefin, S., et al.
Published: (2014) -
Influence of cutting edge radius on small scale material removal at ultra-precise level
by: Rahman, M.A., et al.
Published: (2021) -
Effect of cutting edge radius in ductile mode cutting of brittle materials
by: SHAMSUL AREFIN
Published: (2010) -
The effect of tool edge radius on the contact phenomenon of tool-based micromachining
by: Woon, K.S., et al.
Published: (2014)