New paradigm in IC-package interconnections by reworkable nano-interconnects
Proceedings - Electronic Components and Technology Conference
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sg-nus-scholar.10635-736802024-11-13T13:22:58Z New paradigm in IC-package interconnections by reworkable nano-interconnects Aggarwal, A.O. Raj, P.M. Abothu, I.R. Sacks, M.D. Tay, A.A.O. Tummala, R.R. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 1 451-460 PECCA 2014-06-19T05:38:03Z 2014-06-19T05:38:03Z 2004 Conference Paper Aggarwal, A.O.,Raj, P.M.,Abothu, I.R.,Sacks, M.D.,Tay, A.A.O.,Tummala, R.R. (2004). New paradigm in IC-package interconnections by reworkable nano-interconnects. Proceedings - Electronic Components and Technology Conference 1 : 451-460. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73680 NOT_IN_WOS Scopus |
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Proceedings - Electronic Components and Technology Conference |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Aggarwal, A.O. Raj, P.M. Abothu, I.R. Sacks, M.D. Tay, A.A.O. Tummala, R.R. |
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Conference or Workshop Item |
author |
Aggarwal, A.O. Raj, P.M. Abothu, I.R. Sacks, M.D. Tay, A.A.O. Tummala, R.R. |
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Aggarwal, A.O. Raj, P.M. Abothu, I.R. Sacks, M.D. Tay, A.A.O. Tummala, R.R. New paradigm in IC-package interconnections by reworkable nano-interconnects |
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Aggarwal, A.O. |
title |
New paradigm in IC-package interconnections by reworkable nano-interconnects |
title_short |
New paradigm in IC-package interconnections by reworkable nano-interconnects |
title_full |
New paradigm in IC-package interconnections by reworkable nano-interconnects |
title_fullStr |
New paradigm in IC-package interconnections by reworkable nano-interconnects |
title_full_unstemmed |
New paradigm in IC-package interconnections by reworkable nano-interconnects |
title_sort |
new paradigm in ic-package interconnections by reworkable nano-interconnects |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73680 |
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