New paradigm in IC-package interconnections by reworkable nano-interconnects
Proceedings - Electronic Components and Technology Conference
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| Main Authors: | , , , , , |
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| 其他作者: | |
| 格式: | Conference or Workshop Item |
| 出版: |
2014
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| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/73680 |
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| 機構: | National University of Singapore |