Optimization of flip chip interconnect reliability using a variable compliance interconnect design

Optimization of flip chip interconnect reliability using a variable compliance interconnect design

10.1109/EPTC.2006.342704

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Bibliographic Details
Main Authors: Tay, A.A.O., Sun, W.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73725
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Institution: National University of Singapore
Description
Summary:10.1109/EPTC.2006.342704

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