Optimization of flip chip interconnect reliability using a variable compliance interconnect design

10.1109/EPTC.2006.342704

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書目詳細資料
Main Authors: Tay, A.A.O., Sun, W.
其他作者: MECHANICAL ENGINEERING
格式: Conference or Workshop Item
出版: 2014
在線閱讀:http://scholarbank.nus.edu.sg/handle/10635/73725
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