Super stretched solder interconnects for wafer level packaging
10.1109/ECTC.2006.1645809
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2014
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sg-nus-scholar.10635-738942023-10-30T09:57:06Z Super stretched solder interconnects for wafer level packaging Rajoo, R. Wong, E.H. Lim, S.S. Hnin, W.Y. Seah, S.K.W. Tay, A.A.O. Iyer, M. Tummala, R.R. MECHANICAL ENGINEERING 10.1109/ECTC.2006.1645809 Proceedings - Electronic Components and Technology Conference 2006 1227-1232 PECCA 2014-06-19T05:40:38Z 2014-06-19T05:40:38Z 2006 Conference Paper Rajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R. (2006). Super stretched solder interconnects for wafer level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 1227-1232. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645809 1424401526 05695503 http://scholarbank.nus.edu.sg/handle/10635/73894 000238566601018 Scopus |
| institution |
National University of Singapore |
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NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
10.1109/ECTC.2006.1645809 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Rajoo, R. Wong, E.H. Lim, S.S. Hnin, W.Y. Seah, S.K.W. Tay, A.A.O. Iyer, M. Tummala, R.R. |
| format |
Conference or Workshop Item |
| author |
Rajoo, R. Wong, E.H. Lim, S.S. Hnin, W.Y. Seah, S.K.W. Tay, A.A.O. Iyer, M. Tummala, R.R. |
| spellingShingle |
Rajoo, R. Wong, E.H. Lim, S.S. Hnin, W.Y. Seah, S.K.W. Tay, A.A.O. Iyer, M. Tummala, R.R. Super stretched solder interconnects for wafer level packaging |
| author_sort |
Rajoo, R. |
| title |
Super stretched solder interconnects for wafer level packaging |
| title_short |
Super stretched solder interconnects for wafer level packaging |
| title_full |
Super stretched solder interconnects for wafer level packaging |
| title_fullStr |
Super stretched solder interconnects for wafer level packaging |
| title_full_unstemmed |
Super stretched solder interconnects for wafer level packaging |
| title_sort |
super stretched solder interconnects for wafer level packaging |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73894 |
| _version_ |
1781783346555125760 |