Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines

Journal of Applied Physics

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Main Authors:	Chua, H.N., Pey, K.L., Lai, W.H., Siah, S.Y.
Other Authors:	ELECTRICAL ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/80447
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-80447
record_format	dspace
spelling	sg-nus-scholar.10635-804472015-01-24T20:57:25Z Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines Chua, H.N. Pey, K.L. Lai, W.H. Siah, S.Y. ELECTRICAL ENGINEERING Journal of Applied Physics 87 12 8401-8406 JAPIA 2014-10-07T02:57:39Z 2014-10-07T02:57:39Z 2000-06-15 Article Chua, H.N.,Pey, K.L.,Lai, W.H.,Siah, S.Y. (2000-06-15). Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines. Journal of Applied Physics 87 (12) : 8401-8406. ScholarBank@NUS Repository. 00218979 http://scholarbank.nus.edu.sg/handle/10635/80447 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Journal of Applied Physics
author2	ELECTRICAL ENGINEERING
author_facet	ELECTRICAL ENGINEERING Chua, H.N. Pey, K.L. Lai, W.H. Siah, S.Y.
format	Article
author	Chua, H.N. Pey, K.L. Lai, W.H. Siah, S.Y.
spellingShingle	Chua, H.N. Pey, K.L. Lai, W.H. Siah, S.Y. Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines
author_sort	Chua, H.N.
title	Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines
title_short	Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines
title_full	Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines
title_fullStr	Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines
title_full_unstemmed	Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines
title_sort	formation of voids in ti-salicided bf+ 2-doped submicron polysilicon lines
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/80447
_version_	1681088889338462208

Formation of voids in Ti-salicided BF+ 2-doped submicron polysilicon lines

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