Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects

10.1116/1.1795251

Saved in:

Bibliographic Details
Main Authors:	Wang, G., Jong, Y.W., Balakumar, S., Seah, C.H., Hara, T.
Other Authors:	ELECTRICAL & COMPUTER ENGINEERING
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/82291
Tags:	Add Tag No Tags, Be the first to tag this record!
Institution:	National University of Singapore

id	sg-nus-scholar.10635-82291
record_format	dspace
spelling	sg-nus-scholar.10635-822912023-10-31T08:07:41Z Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects Wang, G. Jong, Y.W. Balakumar, S. Seah, C.H. Hara, T. ELECTRICAL & COMPUTER ENGINEERING 10.1116/1.1795251 Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 22 5 2384-2390 JVTBD 2014-10-07T04:27:39Z 2014-10-07T04:27:39Z 2004-09 Article Wang, G., Jong, Y.W., Balakumar, S., Seah, C.H., Hara, T. (2004-09). Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 22 (5) : 2384-2390. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1795251 10711023 http://scholarbank.nus.edu.sg/handle/10635/82291 000225048300025 Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	10.1116/1.1795251
author2	ELECTRICAL & COMPUTER ENGINEERING
author_facet	ELECTRICAL & COMPUTER ENGINEERING Wang, G. Jong, Y.W. Balakumar, S. Seah, C.H. Hara, T.
format	Article
author	Wang, G. Jong, Y.W. Balakumar, S. Seah, C.H. Hara, T.
spellingShingle	Wang, G. Jong, Y.W. Balakumar, S. Seah, C.H. Hara, T. Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects
author_sort	Wang, G.
title	Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects
title_short	Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects
title_full	Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects
title_fullStr	Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects
title_full_unstemmed	Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects
title_sort	enhancement of adhesion strength of cu seed layer with different thickness in cu/low-k multilevel interconnects
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/82291
_version_	1781784101623169024

Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects

Similar Items