Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects

Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects

10.1116/1.1795251

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Bibliographic Details
Main Authors: Wang, G., Jong, Y.W., Balakumar, S., Seah, C.H., Hara, T.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/82291
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/82291

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