Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects
10.1116/1.1795251
Saved in:
| Main Authors: | , , , , |
|---|---|
| 其他作者: | |
| 格式: | Article |
| 出版: |
2014
|
| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/82291 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|
| id |
sg-nus-scholar.10635-82291 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-822912024-11-12T22:38:21Z Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects Wang, G. Jong, Y.W. Balakumar, S. Seah, C.H. Hara, T. ELECTRICAL & COMPUTER ENGINEERING 10.1116/1.1795251 Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 22 5 2384-2390 JVTBD 2014-10-07T04:27:39Z 2014-10-07T04:27:39Z 2004-09 Article Wang, G., Jong, Y.W., Balakumar, S., Seah, C.H., Hara, T. (2004-09). Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 22 (5) : 2384-2390. ScholarBank@NUS Repository. https://doi.org/10.1116/1.1795251 10711023 http://scholarbank.nus.edu.sg/handle/10635/82291 000225048300025 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
10.1116/1.1795251 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Wang, G. Jong, Y.W. Balakumar, S. Seah, C.H. Hara, T. |
| format |
Article |
| author |
Wang, G. Jong, Y.W. Balakumar, S. Seah, C.H. Hara, T. |
| spellingShingle |
Wang, G. Jong, Y.W. Balakumar, S. Seah, C.H. Hara, T. Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects |
| author_sort |
Wang, G. |
| title |
Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects |
| title_short |
Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects |
| title_full |
Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects |
| title_fullStr |
Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects |
| title_full_unstemmed |
Enhancement of adhesion strength of Cu seed layer with different thickness in Cu/low-k multilevel interconnects |
| title_sort |
enhancement of adhesion strength of cu seed layer with different thickness in cu/low-k multilevel interconnects |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/82291 |
| _version_ |
1821204588793954304 |