Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications

10.1109/TED.2004.825110

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Main Authors: Yu, H.Y., Li, M.-F., Kwong, D.-L.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Article
Published: 2014
Subjects:
HfN
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83196
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-831962023-10-29T20:30:26Z Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications Yu, H.Y. Li, M.-F. Kwong, D.-L. ELECTRICAL & COMPUTER ENGINEERING CMOS devices HfN Metal gate electrode Mid-gap work function 10.1109/TED.2004.825110 IEEE Transactions on Electron Devices 51 4 609-615 IETDA 2014-10-07T04:38:25Z 2014-10-07T04:38:25Z 2004-04 Article Yu, H.Y., Li, M.-F., Kwong, D.-L. (2004-04). Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications. IEEE Transactions on Electron Devices 51 (4) : 609-615. ScholarBank@NUS Repository. https://doi.org/10.1109/TED.2004.825110 00189383 http://scholarbank.nus.edu.sg/handle/10635/83196 000220458000014 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic CMOS devices
HfN
Metal gate electrode
Mid-gap work function
spellingShingle CMOS devices
HfN
Metal gate electrode
Mid-gap work function
Yu, H.Y.
Li, M.-F.
Kwong, D.-L.
Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications
description 10.1109/TED.2004.825110
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Yu, H.Y.
Li, M.-F.
Kwong, D.-L.
format Article
author Yu, H.Y.
Li, M.-F.
Kwong, D.-L.
author_sort Yu, H.Y.
title Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications
title_short Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications
title_full Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications
title_fullStr Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications
title_full_unstemmed Thermally robust HfN metal as a promising gate electrode for advanced MOS device applications
title_sort thermally robust hfn metal as a promising gate electrode for advanced mos device applications
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/83196
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