Adhesion measurement of thin films to a porous low dielectric constant film using a modified tape test
10.1163/156856102760099906
Saved in:
Main Authors: | Goh, L.L.N., Toh, S.L., Chooi, S.Y.M., Tay, T.E. |
---|---|
Other Authors: | CHEMICAL & ENVIRONMENTAL ENGINEERING |
Format: | Article |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/84840 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Sfudy on influence of substrate and exposure coffosive environment on adhesion ability of a modified polyethylene lined on blasted steel substrate
by: Chau, Van Dinh
Published: (2017) -
Peel stress analysis of composite joints for debonding
by: Notaria Manav Baiju
Published: (2024) -
Adhesive tapes: from daily necessities to flexible smart electronics
by: He, Xuecheng, et al.
Published: (2023) -
Adhesion and adhesion reliability enhancement of evaporated copper on surface modified poly(tetrafluoroethylene) films from graft copolymerization
by: Wu, S., et al.
Published: (2014) -
Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils
by: Ang, A.K.S., et al.
Published: (2014)