Pore sealing by NH3 plasma treatment of porous low dielectric constant films

Pore sealing by NH3 plasma treatment of porous low dielectric constant films

10.1149/1.2435625

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Bibliographic Details
Main Authors: Peng, H.-G., Chi, D.-Z., Wang, W.-D., Li, J.-H., Zeng, K.-Y., Vallery, R.S., Frieze, W.E., Skalsey, M.A., Gidley, D.W., Yee, A.F.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85560
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/85560

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