Pore sealing by NH3 plasma treatment of porous low dielectric constant films

• Main Authors: Peng, H.-G., Chi, D.-Z., Wang, W.-D., Li, J.-H., Zeng, K.-Y., Vallery, R.S., Frieze, W.E., Skalsey, M.A., Gidley, D.W., Yee, A.F.
• Other Authors: MECHANICAL ENGINEERING
• Format: Article
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85560
• Institution: National University of Singapore

10.1149/1.2435625