Bed of Nails - 100 microns pitch wafer level interconnections process

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors:	Rao, V.S., Tay, A.A.O., Kripesh, V., Lim, C.T., Yoon, S.W.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/85886
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-85886
record_format	dspace
spelling	sg-nus-scholar.10635-858862024-11-13T13:23:17Z Bed of Nails - 100 microns pitch wafer level interconnections process Rao, V.S. Tay, A.A.O. Kripesh, V. Lim, C.T. Yoon, S.W. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 444-449 2014-10-07T09:13:21Z 2014-10-07T09:13:21Z 2004 Conference Paper Rao, V.S.,Tay, A.A.O.,Kripesh, V.,Lim, C.T.,Yoon, S.W. (2004). Bed of Nails - 100 microns pitch wafer level interconnections process. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 444-449. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/85886 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Rao, V.S. Tay, A.A.O. Kripesh, V. Lim, C.T. Yoon, S.W.
format	Conference or Workshop Item
author	Rao, V.S. Tay, A.A.O. Kripesh, V. Lim, C.T. Yoon, S.W.
spellingShingle	Rao, V.S. Tay, A.A.O. Kripesh, V. Lim, C.T. Yoon, S.W. Bed of Nails - 100 microns pitch wafer level interconnections process
author_sort	Rao, V.S.
title	Bed of Nails - 100 microns pitch wafer level interconnections process
title_short	Bed of Nails - 100 microns pitch wafer level interconnections process
title_full	Bed of Nails - 100 microns pitch wafer level interconnections process
title_fullStr	Bed of Nails - 100 microns pitch wafer level interconnections process
title_full_unstemmed	Bed of Nails - 100 microns pitch wafer level interconnections process
title_sort	bed of nails - 100 microns pitch wafer level interconnections process
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/85886
_version_	1821209631760842752

Bed of Nails - 100 microns pitch wafer level interconnections process

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