Bed of Nails - 100 microns pitch wafer level interconnections process

• Main Authors: Rao, V.S., Tay, A.A.O., Kripesh, V., Lim, C.T., Yoon, S.W.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85886
• Institution: National University of Singapore

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004